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100pcs Red Copper Thermal Cooling Pads For Android Phone CPU High Conductivity Copper Sheets, Thickness: 0.3mm

SKU: TBD0606460302
Sale Sold out Pre-order
Regular price R 279.00
Regular price Sale price R 279.00
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5-10 business days

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Processing time: 1-3 business days

Description

100 pieces of red copper thermal cooling pads designed for Android smartphone CPUs provide effective heat dissipation. These pads are suitable for use after chip reballing or motherboard maintenance to prevent overheating.

  • Quantity: 100 pieces
  • Material: Oxygen-free pure copper
  • Dimensions: 12.4mm x 14mm
  • Thickness: 0.3mm
  • Compatibility: Designed for Android smartphone CPUs
  • Function: Provides targeted heat dissipation
  • Application: Replaces damaged OEM thermal materials after CPU rework
  • Prevents short circuits with precision-customized dimensions
  • Available thickness options: 0.1mm, 0.3mm, 0.5mm

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