2UUL BH08 The One Jig Motherboard IC Fixture (Arabic Version)
2UUL BH08 The One Jig Motherboard IC Fixture (Arabic Version)
Spread the cost
No lump sum. No stress. Pick a repayment term that works for your budget — and keep your cash flow intact.
- R294.37/mo 3 months
- R148.85/mo 6 months
- R78.56/mo 12 months
- From R294.37/month over 3 months, or as low as R78.56/month over 12. Total repayable over 12 months: R942.72. Interest at 20.75% p.a. applies.
- Quick online application — most people get a decision within minutes. Your first payment only kicks in 30 days after you buy.
- Mobicred is a registered South African credit provider (NCR reg. NCRCP7852). Available to SA residents aged 18+ with a valid ID and bank account.
At checkout, simply select Mobicred as your payment method.
Continue to checkoutDon't have Mobicred yet? Apply free — takes about 2 minutes →
Mobicred is a revolving credit facility provided by Retail Capital (Pty) Ltd, a registered credit provider (NCR reg. NCRCP7852) in terms of the National Credit Act 34 of 2005. Credit is subject to approval and an affordability assessment. Interest rate: 20.75% p.a. compounded monthly (1.7292%/month). Available to South African residents aged 18 and older. Full terms & conditions apply.
Import Taxes & Duties Included
6-13 business days
In Stock CHN
Processing time: 1-3 days
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Description
The 2UUL BH08 The One Jig Motherboard IC Fixture is a repair fixture designed for mobile phone motherboards. It provides stability during maintenance tasks, preventing clamps from moving and ensuring efficient heat dissipation.
- Product Type: Repair Fixture
- Brand: 2UUL
- Compatibility: Mobile phone motherboards
- Material: Durable materials
- Key Feature: Adjustable design
- Intended Use: Mobile phone maintenance
- Design: Rotary fixed design with no rebound
- Anti-Skid Pad: Prevents clamps from moving during use
- Heat Dissipation: Enhanced by a heat sink at the bottom of the clamp
- Locking Mechanism: Rotary shaft locks the motherboard or IC efficiently
- IC-Type Fixture Support: Designed for removal of back glue
- Adjustment: Can be set at high, middle, and low levels
- Protection: Safeguards upper and lower layers of double-layer motherboards
- Size Compatibility: Suitable for various sizes and shapes of mobile phone motherboards
- Chip Cleaning: Effective for fixing during cleaning of large chips such as CPU and NAND
Questions about features, compatibility, or warranty? Chat with our local support team!
