For Huawei Mate 40 Pro Qianli Mega-idea Multi-functional Middle Frame Positioning BGA Reballing Platform
For Huawei Mate 40 Pro Qianli Mega-idea Multi-functional Middle Frame Positioning BGA Reballing Platform
Spread the cost
No lump sum. No stress. Pick a repayment term that works for your budget — and keep your cash flow intact.
- R159.15/mo 3 months
- R80.47/mo 6 months
- R42.47/mo 12 months
- From R159.15/month over 3 months, or as low as R42.47/month over 12. Total repayable over 12 months: R509.64. Interest at 20.75% p.a. applies.
- Quick online application — most people get a decision within minutes. Your first payment only kicks in 30 days after you buy.
- Mobicred is a registered South African credit provider (NCR reg. NCRCP7852). Available to SA residents aged 18+ with a valid ID and bank account.
At checkout, simply select Mobicred as your payment method.
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Mobicred is a revolving credit facility provided by Retail Capital (Pty) Ltd, a registered credit provider (NCR reg. NCRCP7852) in terms of the National Credit Act 34 of 2005. Credit is subject to approval and an affordability assessment. Interest rate: 20.75% p.a. compounded monthly (1.7292%/month). Available to South African residents aged 18 and older. Full terms & conditions apply.
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6-13 business days
In Stock CHN
Processing time: 1-3 days
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Description
Multi-functional middle frame positioning BGA reballing platform designed for mobile repair. It is suitable for reballing motherboards of Huawei Mate 40 Pro, providing stable positioning during the process.
- Product Type: Repair Platform
- Brand: QIANLI
- Compatibility: Huawei Mate 40 Pro
- Material: CNC machined
- Key Feature: Strong magnetic universal base with three strong magnets
- Intended Use: Reballing
- Dimensions: Not specified
- Color/Variant: Not specified
- Stability: CNC high precision one-piece machining for stable motherboard positioning
- Anti-slip Features: Two anti-slip silicone foot pads to prevent slipping during reballing
- Process Support: Detailed process guidance for each step of reballing
- Clamping: Secure clamping of motherboards at high temperatures
- Mesh Detachment Prevention: Avoids large area mesh detaching during reballing
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