For Huawei Nova 6 5G / Honor V30 Qianli Mega-idea Multi-functional Middle Frame Positioning BGA Reballing Platform
For Huawei Nova 6 5G / Honor V30 Qianli Mega-idea Multi-functional Middle Frame Positioning BGA Reballing Platform
Spread the cost
No lump sum. No stress. Pick a repayment term that works for your budget — and keep your cash flow intact.
- R173.02/mo 3 months
- R87.49/mo 6 months
- R46.17/mo 12 months
- From R173.02/month over 3 months, or as low as R46.17/month over 12. Total repayable over 12 months: R554.04. Interest at 20.75% p.a. applies.
- Quick online application — most people get a decision within minutes. Your first payment only kicks in 30 days after you buy.
- Mobicred is a registered South African credit provider (NCR reg. NCRCP7852). Available to SA residents aged 18+ with a valid ID and bank account.
At checkout, simply select Mobicred as your payment method.
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Mobicred is a revolving credit facility provided by Retail Capital (Pty) Ltd, a registered credit provider (NCR reg. NCRCP7852) in terms of the National Credit Act 34 of 2005. Credit is subject to approval and an affordability assessment. Interest rate: 20.75% p.a. compounded monthly (1.7292%/month). Available to South African residents aged 18 and older. Full terms & conditions apply.
Import Taxes & Duties Included
6-13 business days
In Stock CHN
Processing time: 1-3 days
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Description
The QIANLI Mega-idea Multi-functional Middle Frame Positioning BGA Reballing Platform is a repair platform designed for reballing mobile devices. It provides stable positioning of the motherboard during the reballing process, preventing slanting and ensuring accurate results.
- Product Type: Repair Platform
- Brand: QIANLI
- Compatibility: Huawei Nova 6 5G / Honor V30
- Material: CNC machined
- Key Feature: Strong magnetic universal base with three strong magnetic magnets
- Intended Use: Reballing
- Dimensions: Not specified
- Color/Variant: Not specified
- Foot Pad: Two anti-slip silicone foot pads to prevent slipping during reballing
- Precision: CNC high precision one-piece machining for stable motherboard positioning
- Process: Detailed process for secure clamping of motherboards at high temperatures
- Functionality: Avoids large area mesh detaching, preventing solder paste loss
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