For iPhone 13 Series Qianli Mega-idea Multi-functional Middle Frame Positioning BGA Reballing Platform
For iPhone 13 Series Qianli Mega-idea Multi-functional Middle Frame Positioning BGA Reballing Platform
Spread the cost
No lump sum. No stress. Pick a repayment term that works for your budget — and keep your cash flow intact.
- R179.95/mo 3 months
- R90.99/mo 6 months
- R48.02/mo 12 months
- From R179.95/month over 3 months, or as low as R48.02/month over 12. Total repayable over 12 months: R576.24. Interest at 20.75% p.a. applies.
- Quick online application — most people get a decision within minutes. Your first payment only kicks in 30 days after you buy.
- Mobicred is a registered South African credit provider (NCR reg. NCRCP7852). Available to SA residents aged 18+ with a valid ID and bank account.
At checkout, simply select Mobicred as your payment method.
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Mobicred is a revolving credit facility provided by Retail Capital (Pty) Ltd, a registered credit provider (NCR reg. NCRCP7852) in terms of the National Credit Act 34 of 2005. Credit is subject to approval and an affordability assessment. Interest rate: 20.75% p.a. compounded monthly (1.7292%/month). Available to South African residents aged 18 and older. Full terms & conditions apply.
Import Taxes & Duties Included
6-13 business days
In Stock CHN
Processing time: 1-3 days
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Description
The Qianli Mega-idea Multi-functional Middle Frame Positioning BGA Reballing Platform is a repair platform designed for reballing mobile devices. It provides stable positioning of the motherboard during the reballing process, preventing slanting and ensuring accurate results.
- Product Type: Repair Platform
- Brand: QIANLI
- Compatibility: iPhone 13 Series
- Material: CNC high precision machining
- Key Feature: Strong magnetic universal base with three strong magnets
- Intended Use: Reballing
- Color/Variant: Not specified
- Stability: Stable positioning of the motherboard, no slanting during reballing
- Anti-slip Features: Two anti-slip silicone foot pads to prevent slipping
- Process Support: Detailed process guidance for each step of reballing
- Clamping: Secure clamping of motherboards at high temperatures
- Mesh Detachment Prevention: Avoids large area mesh detaching during reballing
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